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17 Inch YPC‑MX Full‑Lamination Fanless Industrial All‑in‑One PC MES Production Station Touch Panel

  • Model: YPC‑MX‑17
  • Screen Size:17 Inch,Full‑Lamination Capacitive Touch
  • Cooling Mode:Fanless,Front IP65
  • Application:MES Production Line Workstation
  • Product description: YPC‑MX‑17 17‑inch full‑lamination fanless industrial touch all‑in‑one PC. Adopts full‑bonded capacitive touch screen, zero‑fan cooling design, rich industrial I/O interfaces, supports wall‑mount & emb
  • INQUIRY

YPC‑MX‑17 Series Overview

Pre‑order Features:17‑inch full‑lamination capacitive touch screen, fanless enclosed structure, MES workshop station terminal, embedded & wall‑mount dual installation, multi‑COM multi‑LAN industrial interfaces, 7×24h non‑stop workshop operation

[Introduction] YPC‑MX‑17 full‑lamination fanless industrial all‑in‑one PC is optimized for discrete‑manufacturing MES workshop station scenarios. The full‑bonded screen and touch panel eliminate air‑gap, reducing dust and mist interference on the touch surface, offering clearer display and more responsive touch feedback for daily station‑side operation.

Operators can check electronic SOP documents, scan work orders, fill in production data and complete process confirmation directly on the touch screen. Fully enclosed fan‑free aluminum alloy structure removes rotating fan components, avoiding dust accumulation and fan‑caused breakdown in the dusty production environment. It supports both cabinet embedded installation and wall‑mount bracket installation, adapting to different station layout requirements. Built‑in hardware watchdog and auto‑power‑on function guarantee stable unattended operation for long‑shift factory production. It supports secondary development for MES, ESOP, data acquisition and workshop monitoring software.

[System] Optional Intel 7th/10th/12th Gen Core i3/i5/i7 processors. Configurable RAM and SSD satisfy tasks from simple SOP playback to local production‑log storage. Compatible with Windows and Linux operating systems to match diverse industrial software requirements.

[Heat Dissipation] Fanless passive heat‑conduction structure. CPU heat is transferred evenly to thickened aluminum rear shell for natural heat dissipation. No rotating parts, low noise and low maintenance for long‑term workshop deployment.

[Environment] Industrial‑grade EMC anti‑interference capability resists disturbance from on‑site inverters and motors. Wide operating temperature ‑10℃~60℃ adapts to normal factory temperature fluctuation. Front‑panel reaches IP65 dust‑proof and water‑resistant level against splashing liquid and workshop dust.

[Interfaces] Multiple Gigabit Ethernet ports and switchable RS232/RS485 COM ports are available for connecting PLC, barcode scanners and field sensors. Reserved USB, HDMI, GPIO and audio interfaces. MINI‑PCIE and M.2 expansion slots support WIFI, Bluetooth and 4G modules to realize wired and wireless data transmission for MES system.


YPC‑MX‑17

Basic Specifications

Item 7th Gen Config 10th Gen Config 12th Gen Config
Model YPC‑MX‑17 YPC‑MX‑17 YPC‑MX‑17
Display 17" TFT‑LCD 17" TFT‑LCD 17" TFT‑LCD
Touch Screen 10‑point Capacitive Touch, Full‑lamination 10‑point Capacitive Touch, Full‑lamination 10‑point Capacitive Touch, Full‑lamination
Resolution 1920*1080 1920*1080 1920*1080
Brightness 300cd/m² 300cd/m² 300cd/m²
Processor Intel 7th Gen i3/i5/i7 Intel 10th Gen i3/i5/i7 Intel 12th Gen i3/i5/i7
Network 1*Gigabit LAN, optional dual LAN 2*Gigabit LAN 2*Gigabit LAN
Memory 1 slot Max 32GB 2 slots Max 64GB 2 slots Max 64GB
External I/O 2COM(RS232/485 switchable),2USB3.0,2USB2.0,1HDMI 2COM(RS232/485 switchable),2USB3.0,2LAN,1HDMI 2COM(RS232/485 switchable),2USB3.0,2LAN,1HDMI
Expansion Mini‑PCIE for 4G; M.2 2230 for WIFI/BT Mini‑PCIE for 4G; M.2 2230 for WIFI/BT Mini‑PCIE for 4G; M.2 2230 for WIFI/BT
Storage 2.5"SATA SSD/HDD M.2 2280 +2.5"SATA bay M.2 2280 +2.5"SATA bay
Power DC12V, optional 9‑36V wide voltage DC12V, optional 9‑36V wide voltage DC12V, optional 9‑36V wide voltage
OS Windows7/10/11,Linux Windows10/11,Linux Windows10/11,Linux
Mounting Panel embedded / Wall‑mount Panel embedded / Wall‑mount Panel embedded / Wall‑mount
Operating Env ‑10℃ ~ 60℃,10‑90% non‑condensing ‑10℃ ~ 60℃,10‑90% non‑condensing ‑10℃ ~ 60℃,10‑90% non‑condensing
Cooling Fanless Fanless Fanless
Chassis Aluminum alloy, front IP65 Aluminum alloy, front IP65 Aluminum alloy, front IP65

Ordering Information

No. Model Version CPU Memory LAN COM Power
1 YPC‑MX‑17 7th‑A 7th i3/i5/i7 1*SO‑DIMM 1 2 12V(opt9‑36V)
2 YPC‑MX‑17 7th‑B 7th i3/i5/i7 1*SO‑DIMM 2 6 12V(opt9‑36V)
3 YPC‑MX‑17 10th‑B 10th i3/i5/i7 2*SO‑DIMM 2 6 12V(opt9‑36V)
4 YPC‑MX‑17 12th‑B 12th i3/i5/i7 2*SO‑DIMM 2 6 12V(opt9‑36V)
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