Pre‑order Features:19‑inch 4:3 full‑bonded display, IP65 front‑panel dust‑proof splash‑proof, fanless passive cooling design, embedded & wall‑mount dual installation, rich industrial I/O ports, anti‑interference industrial performance, 7×24h workshop central control stable running
[Introduction] YPC‑MX‑190 is a 19‑inch 4:3 full‑bonded fanless industrial touch all‑in‑one PC oriented to workshop central control application. The full‑bonded screen structure reduces air layer between touch panel and LCD, lowering reflection, improving touch response and anti‑fog performance, bringing better visual effect for factory on‑site viewing.
Front panel reaches IP65 protection grade, effectively resist workshop dust, oil mist and liquid splashing. The fanless fully enclosed structure removes fan components, avoiding dust accumulation and fan damage, lowering later‑stage maintenance workload. It supports embedded cabinet installation and wall‑mount installation, adapting to diversified layout demands of workshop central control room and on‑site operation stations.
Equipped with hardware watchdog and auto‑power‑on function, the unit supports unattended long‑time running. It can undertake workshop data centralized display, equipment status monitoring, production parameter configuration and other tasks, well compatible with MES, SCADA and other industrial software for secondary development.
[System] Support Intel 7th/10th/12th‑Gen Core i3/i5/i7 processors. RAM and SSD are configurable to satisfy local data storage and multi‑software concurrent operation. Compatible with Windows and Linux industrial operating systems, realizing smooth docking with various factory automation platforms.
[Heat Dissipation] Adopt fanless passive thermal conduction solution. CPU heat transfers evenly to the alloy housing for natural heat dissipation. No rotating mechanical parts, achieve low‑noise, maintenance‑free performance for long‑term workshop deployment.
[Environment Adaptation] Built‑in industrial‑level EMC anti‑interference capability, resisting signal disturbance from inverters and on‑site mechanical equipment. Wide‑temperature design adapts to temperature fluctuation of factory workshops. Reinforced structure handles on‑site vibration impact.
[Interfaces] Dual Gigabit Ethernet ports and multi‑group switchable RS232/RS485 COM ports realize stable connection with PLC, sensors and acquisition devices. Multiple USB, HDMI and audio interfaces reserve expansion space. Reserved slots support WIFI, Bluetooth and 4G module expansion for diverse networking requirements.
| Item | 7th Gen Config | 10th Gen Config | 12th Gen Config |
|---|---|---|---|
| Model | YPC‑MX‑190 | YPC‑MX‑190 | YPC‑MX‑190 |
| Display | 19" TFT‑LCD,4:3,1280*1024 | 19" TFT‑LCD,4:3,1280*1024 | 19" TFT‑LCD,4:3,1280*1024 |
| Touch | Full‑bonded Capacitive Touch | Full‑bonded Capacitive Touch | Full‑bonded Capacitive Touch |
| Brightness | 300cd/m² | 300cd/m² | 300cd/m² |
| Processor | Intel 7th Gen i3/i5/i7 | Intel 10th Gen i3/i5/i7 | Intel 12th Gen i3/i5/i7 |
| Network | 1*Gigabit LAN(optional dual‑LAN) | 2*Gigabit LAN | 2*Gigabit LAN |
| Memory | 1*SO‑DIMM,Max 32GB | 2*SO‑DIMM,Max 64GB | 2*SO‑DIMM,Max 64GB |
| I/O | 2COM(RS232/485 switchable),2USB3.0,USB2.0,HDMI,Audio | 2COM(RS232/485 switchable),2USB3.0,Dual LAN,HDMI | 2COM(RS232/485 switchable),2USB3.0,Dual LAN,HDMI |
| Expansion | Mini‑PCIE(4G),M.2 2230(WIFI/BT) | Mini‑PCIE(4G),M.2 2230(WIFI/BT) | Mini‑PCIE(4G),M.2 2230(WIFI/BT) |
| Storage | 2.5"SATA HDD/SSD | M.2 2280 NVMe/SATA+2.5"SATA | M.2 2280 NVMe/SATA+2.5"SATA |
| Power | DC12V(opt.9‑36V wide voltage) | DC12V(opt.9‑36V wide voltage) | DC12V(opt.9‑36V wide voltage) |
| OS | Windows7/10/11,Linux | Windows10/11,Linux | Windows10/11,Linux |
| Mounting | Embedded / Wall Mount | Embedded / Wall Mount | Embedded / Wall Mount |
| Protection | IP65 Front Panel | IP65 Front Panel | IP65 Front Panel |
| Cooling | Fanless Passive Cooling | Fanless Passive Cooling | Fanless Passive Cooling |
| Working Env | ‑10℃~60℃,10%‑90% non‑condensing | ‑10℃~60℃,10%‑90% non‑condensing | ‑10℃~60℃,10%‑90% non‑condensing |
| Chassis | Alloy Housing | Alloy Housing | Alloy Housing |
| No. | Model | Version | CPU | Memory | LAN | COM | Power |
|---|---|---|---|---|---|---|---|
| 1 | YPC‑MX‑190 | 7th‑A | 7th i3/i5/i7 | 1*SO‑DIMM | 1 | 2 | 12V(opt9‑36V) |
| 2 | YPC‑MX‑190 | 7th‑B | 7th i3/i5/i7 | 1*SO‑DIMM | 2 | 6 | 12V(opt9‑36V) |
| 3 | YPC‑MX‑190 | 10th‑B | 10th i3/i5/i7 | 2*SO‑DIMM | 2 | 6 | 12V(opt9‑36V) |
| 4 | YPC‑MX‑190 | 12th‑B | 12th i3/i5/i7 | 2*SO‑DIMM | 2 | 6 | 12V(opt9‑36V) |
Contact: Daisy
Phone: +86 13671794424
Tel: +86 18616572215
Add: 3rd Floor, Block 5, No. 398 Songying Road, Qingpu District, Shanghai, China, 201703